Technology : COB
Process : Dice Mounting
ASM  - AD896-06 Auto Die Bonder Precision Placement
        - Accuracy= +/- 38 um
        - Die Rotation: +/- 3 deg
High Productivity (Cycle Time 420 ms)
Powerful Inspection System
        - Wafer PRS with PR look ahead capability
        - Advanced Dice surface inspection at wafer stage