Home Encapsulation
Encapsulation Print E-mail
















Technology : COB
Process : Encapsulation
ASM – Precision Dispensing System : DS500
Excellent epoxy placement repeatability and dispensing quality
Extra large dispensing area with gantry table design
Needle height sensor to overcome substrate height variation
Needle heater to compensate epoxy viscosity variation
Automatic Needle cleaning system
Built-in intelligent inspection system for automatic substrate alignment.
Custom programmable dispensing pattern & parameters

 


Copyright Terms & Conditions, Privacy Policy and Disclaimer
© 2010 UCHI Technologies Berhad. All Rights Reserved.