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Technology : COB
Process : Wire Bonding
ASM - AD559A Rotary Bond-head Wedge Bonder
Fine Pitch Capability : Pad Pitch 68 um; Pad size: 68 x 80 um
BQM System for bond ability enhancement
Intelligent pattern recognition capability
Vision Lead Locater ( VLL) to adapt lead size variation
Dual Color (Red-Blue) lighting for different substrate surface reflection
Aluminum/ Gold wire wedge option
30/ 60 deg wire feed angle option


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