Technology : COB
Process : Dice Mounting

ASM – AD896-06 Auto Die Bonder Precision Placement

• Accuracy= +/- 38 um
• Die Rotation: +/- 3 deg

High Productivity (Cycle Time 420 ms)
Powerful Inspection System

• Wafer PRS with PR look ahead capability
• Advanced Dice surface inspection at wafer stage

Technology : COB
Process : Encapsulation
ASM – Precision Dispensing System : DS500
Excellent epoxy placement repeatability and dispensing quality
Extra large dispensing area with gantry table design
Needle height sensor to overcome substrate height variation
Needle heater to compensate epoxy viscosity variation
Automatic Needle cleaning system
Built-in intelligent inspection system for automatic substrate alignment.
Custom programmable dispensing pattern & parameters

Technology : COB
Process : Wire Bonding
ASM – AD559A Rotary Bond-head Wedge Bonder
Fine Pitch Capability : Pad Pitch 68 um; Pad size: 68 x 80 um
BQM System for bond ability enhancement
Intelligent pattern recognition capability
Vision Lead Locater ( VLL) to adapt lead size variation
Dual Color (Red-Blue) lighting for different substrate surface reflection
Aluminum/ Gold wire wedge option
30/ 60 deg wire feed angle option

Technology : SMT
Process : SMT Component Automatic Mounter
Yamaha- YS100 High Speed High Accuracy General Purpose Modular Mounter
Mounting Accuracy: ±0.05mm (chip); ±0.03mm (QFP)
Mounting Capacity(IPC9850): 25,000CPH
Applicable components: 0402 to 45 x 100mm; Height 15mm or less, Ball type electrode applicable;
Equipped with Electronic Feeder
Equipped with nozzle auto-change station
Included sATS auto IC tray handler
Included bar-code verification software and hardware

Technology : SMT
Process : SMT Component Automatic Mounter
Juki JX-200 High Speed High Accuracy General Purpose Modular Mounter
Mounting Accuracy: ±0.05mm (Laser Recognition); ±0.04mm (Pattern Recognition)
Mounting Capacity(IPC9850): 13,900CPH
Applicable components: 0603; Height 12mm or less
Equipped with 6 in-line nozzle

Technology : SMT
Process : SMT Component Automatic Mounter
Yamaha-YSM20R High-end High-efficiency Modular mounter
Mounting Accuracy: ± 0.035mm, Cpk ≤ 1.0
Mounting Capability (2-beam system with 2 x HM head) : 90,000 CPH
Applicable components: 03015 to 45 x 100mm;Height 15mm or less.
Bar-code verification software and hardware

Technology : SMT
Process : Chip-bonder Dispenser
YAMAHA- YGD Modular High-Precision High-Speed Dispenser
Z-axis and R-axis are servo-controlled independently, Able to achieve
accuracy= +/- 0.1 mm
Fast Dispensing Speed of 0.09 sec/shot
Up to two heads can be installed, ensuring applicability to all
dispensing conditions

Technology : Through-Hole
Process : Wave Soldering

ANDA AUTOMATIC WAVE SOLDERING MACHINE -JN-350 SERIES
1. High accuracy temperature controlled for lead-free soldering
2. Pre-heat portion utilize independent module design, safer and more convenient for maintenance.
3. Equipped with heat compensation feature to prevent drastic temperature drop of PCB moving from preheat zone to solder pot
4. Adjustable solder pot wave’s width to reduce solder dross generation.
5. Equipped with solder dross re-cycle pot. Able to claim back usable solder.
6. Utilize advanced sapphire heat generation technique for Pre-heat zone to ensure even temperature distribution on PCB.

Technology : Stud Welding
Process : Metal parts Stud Welding

STUD WELDING MACHINE-SOYER BMS-10N
Energy source for welding different welding element on metallic workpieces
Welding range: M3 – M10 with steel and stainless steel
M3- M8 with aluminum and brass
Charging Capacity: 88,000 uF( Optional 132,000 uF for M10 Steel studs)
Automatic stabilization of charging voltage

• Charging Voltage: 55- 220 V

Short Charging Cycles to increase productivity

• Welding Time: 0.001 – 0.003 Sec

New ” Charging Control” allowing very high welding sequences during continuous application

• Welding Sequence: 20 Studs/ Min

Welding Pistol:PS-3 positioning welding pistol
Self- protection against over stress to guarantee a long service life
Fulfill all prescribed safety targets:

Technology : Final Test & Middle Test
Process : Emulator-based Function Test
Engineering Laboratory capability
Fabricate final test jig and software development
Jig qualification and testing before released for production
Support product functional defect bench test verification and analysis

Technology : In Circuit Training
Process : ICT
TR518F In Circuit Tester
High-End Semiconductor CMOS Switching design- no life limitation concern
High Capacity rack design, test point up to 3584
Utilizing HP Test Jet Technology
Equipped with IC Clamping Diode test
Leakage current and 3-point measurement is able to detect polarity on capacitor
1 MHz Ac Signal for testing small capacity and inductor
Transistor, FET, SCR and photo-coupler testing mode available

Technology : Burn-In
Process : Elevated Temperature Functional Test

DISPLAY COMPLETE SET BURN-IN
Utilizing oven exhaust hot air in enclosed room as well as sunlight to heat up the room during burn-in.
Example of energy saving effort by UCHI
LED display will be assembled in complete set before subject to burn-in

Technology : SMT
Process : Reflow Soldering

Heller 1809MKIII Forced Hot Air Convection Reflow Oven
9 Top zones and 9 Bottom Zones
Zone by zone heat up features
PID temperature controller to ensure zone temperature stability to ± 1 deg C
Spike Zone design for minimal liquidous time
Complete computer control system
Complete software package include ECD CPK & SPC data and alarm logging
Complete KIC & ECD profiling includes 5 thermocouple Real Time profiling

Technology : SMT
Process : Reflow Soldering

Heller 1936 MK5 (Air) Dual lane SMT Reflow Oven
10 Top & Bottom Forced Convection Zones
3 Cooling Zones Standard Cooling Systems
Accuracy of Temperature Controller : ±0.1°C
Complete KIC & ECD profiling includes 5 thermocouple Real Time profiling
Complete software package include ECD CPK & SPC data and alarm logging

Technology : SMT
Process : Solder Paste Printing
GKG G9 G-series In-line Automatic Screen Printer
Printing accuracy : ± 0.025mm
Positioning repeatability : ±0.01mm
Print format (X/Y) : 50mm x 50mm (min), 400mm x 310mm (max)

Technology : Selective Soldering
Process : Selective Wave soldering

EBSO SPA 400 NC Selective Soldering System
Accuracy/Repeatability:
± 0.1 mm; Speed: 18m/min
3 Axis Servo Drives System
Transport Angle 7º fix
Microdrop fluxer for single point and line fluxing
Digital N2 Control with Standby Function
Quick IR Emitter Preheater
Automatic Solder Wire Feeder
Mini Wave solder pot with 65mm nozzle width
Off-line ”Point & click”programming ; Integrated Photo editor;
Import gerber file​

Technology : Automated Optical Inspection(AOI)
Process : AOI After SMT Reflow Soldering

V510i 3D In-line Automated Optical Inspection
Phase shift Profilometry’s (PSP) Methodology with 4 way projectors.
X Y Axis Resolution : 1 micron
Camera Configuration : 4 megapixels
Inspection Speed : 22.0 – 37.0cm²/sec
Camera Resolution : 20um per pixel
Lighting System : Concurrent lighting Module.
Component Capability : 01005 component ready @ 12um
Other features:

• OCV (Optical Character Verification)
• OCR (Optical Character Recognition)
• Z-Height Motor for tall component
• Camera read barcode system

​

Technology : Automated Optical Inspection(AOI)
Process : AOI After MI and Wave Soldering

TR-7500DT Table Top AOI System

PCB Handling Capability: 50mmx50mm -250mmx330mm
XY Table Resolution: 1 micron
Camera Configuration: 1024 x 768
Camera Resolution: 20 micron
Lighting System:Multi-segment, multi-angle LED; RGB+W
Component Capability: 01005 component ready @ 10um
Imaging Speed(per Sec): 43cm2
Other Features:

• OCV( Optical Character Verification)

​

Technology : Work-cell Production System
Process : Work-cell Assembly

Features:

• Higher efficiency as compared to conveyor-based assembly line due to:
  minimized operator waiting time and shorter setup time
• Minimal inventory between processes
• Increased visibility
• Simplified scheduling and communication
• Provide quick feedback and problem solution
• Workers are trained to understand whole process
• Development of increased product knowledge

Technology : SMT
Process : PCB Laser Barcode Printing

Vectron VL-200 Inline Laser Marker
Printing accuracy up to 0.02mm
Program control, fully automatic adjustment and changing the line to switch the procedure
Laser type: CO2, Optical fibre
CCD vision position: Industry CCD, Mark point compensation

Technology : Solder Paste Inspection (SPI)
Process : SPI After Solder Paste Printing
KohYoung Technology KY8030-2 3D In-line Solder Paste Inspection Systems
3D Shadow Free Moiré Technology & Dual Projection
Full 3D Inspection Speed : 22.5 ~ 56.1cm²/sec.
4M pixel Camera with IR-RGB LED Dome Styled Illumination
Z-Resolution of 0.37μm
X, Y Accuracy : 2.5 nano meter (PZT Accuracy)
Maximum Inspection Size : 10mm x 10mm
Maximum Inspection Height : 400μm
Maximum Distance between PADs : 100μm